Evaluating COM Specific and COM-HPC for Your Initiatives

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When the
COM-HPC customary was first mooted in 2019, there was, understandably, some preliminary concern available in the market over its potential influence on COM Specific Sort 6 and seven modules. This rapidly dissipated as soon as the specification turned clear. In spite of everything, they have been all the time supposed to be complementary requirements and clearly differentiated with respect to efficiency, general characteristic units, and worth degree.

However with the rising alternative of COM-HPC merchandise now out there, how do you select between these and people primarily based on the
long-established COM Specific COM customary?

COM Specific is likely nonetheless the appropriate platform to make use of when:

• The efficiency degree and reminiscence capability match the appliance necessities – processor TDP as much as 60 W – reminiscence capability as much as 128 GB
• A smaller footprint and thermal restrict are crucial
• Extending the longevity of an current COM Specific answer to save lots of funding and guarantee continuity
• There’s a low to medium funds consideration

COM-HPC, however, is extra more likely to be viable when:

• Processor energy is required past 60 W TDP
• Reminiscence capability should transcend the restrict of 128 GB
• Sooner interfaces comparable to USB 4.0, PCIe Gen 4/5 or 25Gbit Ethernet (permitting 100GbE interfaces) are required
• To accommodate the above, a bigger footprint and worth degree are accepted

COM-HPC /Shopper modules are positioned above
COM Specific Sort 6 for a variety of embedded purposes – the place the priorities are elevated processing and graphics capabilities, sooner knowledge transmission, and community connectivity.

• Energy envelope as much as 150W
• As much as 48 + 1 PCI Specific Gen4/5 lanes
• As much as 4 graphics interfaces
• As much as 2x 25 Gb Ethernet interfaces
• Module sizes: A: 95 x 120 mm; B: 120 x 120 mm; C: 160 x 120 mm

For instance,
COM-HPC Shopper Modules Sort A and C can be utilized successfully in a spread of high-end embedded shopper merchandise requiring a number of shows. Typical makes use of are in networking, automation, measurement, and AI purposes for medical gear, high-end instrumentation, industrial gear, on line casino gaming gear, ruggedized subject PCs, transportation, and protection techniques.

Deciding between COM Specific and COM-HPC on your embedded initiatives? Whereas COM Specific fits purposes with particular efficiency and funds constraints, COM-HPC excels in high-performance eventualities, particularly in AI, Machine Studying, and 5G.

COM Specific Sort 6 addresses many embedded purchasers’ wants by providing a broad vary of I/O interfaces for graphics, Digital Show Interfaces (DisplayPort, HDMI, LVDS, or eDP), and super-fast USB 3.1. It’s subsequently geared up to serve many utility necessities throughout varied market segments. Embedded options producers have helped this by providing important purposes pre-integrated on provider boards and customized interfaces.

All crucial performance is available on the single board degree. COM Specific Sort 6 additionally affords vast scalability with compact and primary dimension kind components and a confirmed potential to make use of processors with a TDP (thermal design energy) of fifty watts or extra.

What about Server Modules?

COM Specific Sort 7 is a well-liked alternative to be used in server-grade edge platforms the place excessive knowledge throughput is crucial. The pin-out is a complementary specification to the prevailing Sort 6 pin-out, changing graphics assist with a number of 10GbE-KR ports and defining 32 PCIe lanes.

COM-HPC Server modules A and D., however, provide even increased scalability, compute, and communications efficiency. These are supposed for very high-performance edge server-class purposes with huge knowledge volumes at stake, requiring real-time evaluation and transmission.

Synthetic Intelligence, Machine Studying, and Deep Studying are typical examples, together with autonomous driving and 5G. That is the place COM-HPC servers’ elevated processing efficiency and larger connectivity come to the fore.

• Energy envelope as much as 300W
• As much as 64 + 1 PCI Specific Gen4/5 lanes
• No graphic interfaces
• As much as 8x 25 Gb Ethernet interfaces enabling 100Gb Ethernet
• Module sizes: D: 160 x 160 mm; E: 200 x 160 mm

To be taught which COM is correct on your subsequent embedded undertaking, go to Kontron.com